Postdoctoral Researcher in Wafer Bonding Physics for 3D Chip Integration

University of Twente

Posted: 2026-05-23 - Enschede, NLD

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Summary

This 2-year postdoctoral position involves investigating wafer bonding physics for 3D chip integration, combining surface science, advanced metrology, and semiconductor process development in collaboration with industry.

Position details

  • Role area: postdoc
  • Employment type: full time
  • Research field: Physics
  • Research topic: Wafer Bonding Physics
  • Application deadline: 2026-06-21