PostDoc position on Wafer Bonding Physics for 3D Chip Integration

University of Twente

Posted: 19 September 2026 - Enschede, Netherlands

View on utwentecareers.nl Back to all openings

About this opening

? This summary is AI-generated from the source advert. Check the original posting for authoritative details before applying.

Join the University of Twente as a Postdoctoral Researcher in Wafer Bonding Physics for 3D Chip Integration. This 2-year position in the XUV Optics group involves investigating the physics behind wafer bonding, combining surface science and semiconductor process development. Ideal candidates will have a PhD in materials science or related fields and experience with relevant characterization techniques. Proficiency in English is required. Apply by October 17, 2026.

Position details

? These details are extracted from the source advert. Check the original posting for authoritative requirements and dates before applying.
  • Role: postdoc
  • Employment type: full time
  • Research field: Engineering
  • Research topic: Wafer Bonding Physics
  • Language: English
  • Application deadline: 17 October 2026

Related openings

More at University of Twente More in Netherlands More in Engineering More about Wafer Bonding Physics Browse all open jobs